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WLP Wafer level packaging Vs PLP Panel level packaging and CERAMERIC EXtra Large Porous Ceramic Vacuum Chuck
WLP Wafer level packaging Vs PLP Panel level packaging and
CERAMERIC EXtra Large Porous Ceramic Vacuum Chuck
| Feature | Wafer-Level Packaging (WLP) | Panel-Level Packaging (PLP) |
|---|---|---|
| Substrate shape | Circular wafer (200–300 mm) | Rectangular panel (up to 600 mm) |
| Typical material | Silicon wafer | Organic, glass, or molded panel |
| Die placement | Native wafer | Reconstituted panel (fan-out) |
| Cost efficiency | Moderate | Higher (more dies per batch) |
| Size scalability | Limited (≤300 mm) | Large-scale, panel-based |
| Process maturity | High (mass production) | Emerging / developing |
| Target devices | Mobile ICs, sensors | High-density, large-area modules |
| Integration | Mostly single-die | Multi-die, heterogeneous possible |
Once again, we are ready to take the "extra large" challenge
CERAMERIC SEMIXICON is supplying panel level packaging porous ceramic chuck
1064x40x991 mm
1064x40x701x701mm
extra large porous ceramic vacuum chuck
#PSG011-P03001-01
#Panel level packaging
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