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SILICON CARBIDE WAFER GRINIDNG WHEELS
Machine Make | Machine Model | Grindiing Wheels | Wafer Size | SEMXICON PN |
DISCO | 83H/6 Series | 6A2T/C 195*25*170*4.5*5 | 3"--6" | 750001 |
IF, 800 & 8540 Series | 6A2T/C 209*22.5*158.3*3.5*5 | 4"--8" | 750002 | |
8560&8761 Series | 6A2T/C 313*30*237*3*5 | 8"--12" | 750003 | |
ACCRETECH | PG3000 | 6A2T/C 254*33*190*3*6 | 8“--12” | 750004 |
AM | VRG-300F | 6A2T/C 313*31*237*3*5 | 4"--12" | 750005 |
GALAXY | 6A2T/C 305*40*95*3*5 | 4"--12" | 750006 | |
G&N | 300 | 6A2 175*35*76*5*5 | 2“--8” | 750007 |
VG | 502 | 6A2T/C 254*33*155*3*5 | 6“--8” | 750008 |
Others | Customized Manufacturing Welcomed |
Advantange: Efficiency ,Precison and Durability
Application : Ultra precision semiconductor wafer grinding
Affordability: Great cost with premium quality
Agility: Fast responding and speedy delivery