Wafer grinders are used to  thin silicon wafers, compound semiconductor wafers etc with a high degree of accuracy.Each grinders are using 1 or up to 5 pieces of porous ceramic chuck tables in this critical process.

Till today, hundres of Semixicon wafer thinning chuck tables are smoothly grinding on popular wafer grinders such as DISCO DFG8540,DFG8640,DFG8560,DFG8830,DFG8340,DAG810. That means at least tens of thousand dollar annual savings on each grinder.

Happy grinding!