SEMIXICON Wafer Chuck for DBG / SDBG Processes

DBG (Dicing Before Grinding) and SDBG (Stealth Dicing Before Grinding) place extremely high demands on wafer holding accuracy, stress control, and backside integrity, especially for 300 mm ultra-thin wafers. SEMIXICON wafer chucks are purpose-engineered to meet these requirements by providing stable, low-stress, and highly uniform wafer fixation throughout half-cut dicing, stealth dicing, and back-grinding separation.

For DBG/SDBG applications, SEMIXICON chucks feature optimized vacuum channel design and micro-patterned chuck surfaces, ensuring uniform clamping force across the wafer while minimizing localized stress concentration. This effectively suppresses warpage, backside chipping, and micro-crack propagation during both partial dicing and final chip separation by grinding.

The chuck materials are selected for high stiffness, excellent thermal stability, and chemical durability, enabling consistent flatness and positional accuracy under high-speed grinding and laser-assisted SDBG conditions. Low backside damage characteristics and high particle cleanliness further support high die strength and yield stability in thin-wafer production.

SEMIXICON wafer chucks are compatible with DBG and SDBG grinding systems, dicing saws, and laser stealth dicing platforms, and can be customized for wafer size, target thickness, groove depth, and tape configurations. By ensuring precise wafer support from dicing to final separation, SEMIXICON wafer chucks serve as a key enabling component for reliable, high-throughput DBG/SDBG manufacturing.